SYSTEM.INITIALIZE: BLUEPRINT_UNFOLD
DWG TITLEPORTFOLIO BLUEPRINT
DRAWN BYDINESH KUMAR
SCALE1:1
REVISIONA.02
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Thermal Engineering

Conduction Heat Transfer Simulator

Analyze conduction heat transfer through a solid medium using Fourier's law of heat conduction. Adjust thermal conductivity, surface area, temperature differences, and material thickness to see how heat transfer rate is affected.

Governing Law
Fourier Conduction
1D Steady-State
Mesh
51 nodes
Linear Gradient
Output
CSV
Ready to export

Parameters

Material Preset
Temperature Sweep

Governing Equations (Conduction)

Fourier's Law
Q = (k * A * ΔT) / Δx
Heat Flux
q'' = Q / A = (k * ΔT) / Δx
Thermal Resistance
Rth = Δx / (k * A)
Temperature Gradient
dT/dx = -ΔT / Δx

Conductivity k = 205 W/mK (Aluminum).

Thermal resistance for this configuration is 0.00012 K/W.

The temperature drop across the thickness is completely linear under steady-state conditions with no internal heat generation.

Thermal Gradient and Heat Flux

Hot Side75.0 °CCold Side25.0 °CThickness Δx = 0.050 mCross-Sectional Area A = 2.0Material: Aluminum (k = 205 W/mK) • Thermal Resistance Rth = 0.0001 K/W
Heat Transfer Rate (Q)
410000.0W
Rate in Kilowatts
410.000kW
Heat Flux (q'')
205000.0W/m²
Thermal Resistance (Rth)
0.00012K/W

Linear Temperature Gradient through Wall

Temperature Node Results

Position x (m)Depth (%)Temperature (°C)
0.000 m0%75.0°C
0.005 m10%70.0°C
0.010 m20%65.0°C
0.015 m30%60.0°C
0.020 m40%55.0°C
0.025 m50%50.0°C
0.030 m60%45.0°C
0.035 m70%40.0°C
0.040 m80%35.0°C
0.045 m90%30.0°C
0.050 m100%25.0°C