Thermal Engineering

Injection Molding Cooling Simulator

Analyze 1D transient heat conduction through polymer thickness. Simulate the temperature decay at the part center, predict ejection readiness, and explore the effect of polymer thermal properties.

Model

Transient 1D Heat

Analytic Fourier Series

Material Preset

Standard Preset

Output

CSV

Export ready

Process & Material Parameters

Material Preset

Part Thickness3.00 mm

0.510

Melt Temperature (Tm)230 °C

150350

Mold Temperature (Tw)40 °C

20120

Ejection Temperature (Te)90 °C

50150

Thermal Conductivity (k)0.15 W/m·K

0.10.5

Density (ρ)900 kg/m³

8001600

Specific Heat (Cp)1900 J/kg·K

10003000

Time Elapsed0.00 s

025

Transient Cooling Playback

Transient Heat Model

Cooling Time (t_cool)

t_cool = (s^2 / (pi^2 * alpha)) * ln((4/pi) * (Tm - Tw) / (Te - Tw))

Thermal Diffusivity (alpha)

alpha = k / (rho * Cp)

Dimensionless Fourier Number (Fo)

Fo = (alpha * t) / (s/2)^2

The 1D Fourier series model calculates temperature evolution under transient heat conduction.

For the current configuration, ejection readiness occurs at t = 16.39 seconds when the core temperature cooling curve crosses below Te (90°C).

Assumes the mold cavity walls remain at a constant mold temperature (Tw).

Molded Part & Core/Cavity Plates

Estimated Cooling Time

16.39s

Thermal Diffusivity

0.0877mm²/s

Active Center Temp

230.0°C

Fourier Number (Fo)

0.639

Part Center Temperature Profile

Cooling Log Data

Time Elapsed (s)	Center Temp (°C)
0.00	230.0
2.08	225.0
4.17	199.8
6.25	172.2
8.33	148.5
10.42	128.8
12.50	112.7
14.58	99.5
16.67	88.7
18.75	79.8
20.83	72.6
22.92	66.7
25.00	61.8