SYSTEM.INITIALIZE: BLUEPRINT_UNFOLD
DWG TITLEPORTFOLIO BLUEPRINT
DRAWN BYDINESH KUMAR
SCALE1:1
REVISIONA.02
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Thermal Engineering

Peltier Cooler Simulator

Investigate the heat transfer rates, power inputs, and Coefficient of Performance (COP) of a Peltier thermoelectric cooler. Tweak semiconductor properties and temperatures to determine thermal bounds.

Cooler Tech
Thermoelectric
Solid-state
Mesh State
6 Junctions
Steady state
Output
CSV
Export ready

Parameters

Thermoelectric Material
Animated flow view

Thermoelectric Cooler Physics

Cooling Power
Qc = α*Tc*I - 0.5*I²*R - K*(Th - Tc)
Input Power
Pin = α*(Th - Tc)*I + I²*R
Coefficient of Performance
COP = Qc / Pin
Hot-Side Rejection
Qh = Qc + Pin

Operating current is set at 4.00 A, with Seebeck coefficient α = 0.045 V/K.

Maximum cooling power occurs at optimum current: I_opt = (α * Tc) / R ≈ 6.75 A.

Joule heating (0.5 * I² * R) creates a thermal barrier that reduces net cooling at higher currents.

Solid-State Microstructure

Thermoelectric ModuleCurrent: 4.0 A
Cold Side (Tc) = 270 KHot Side (Th) = 300 KPNPNPNQc = 20.7WQh = 54.9W
Net Cooling (Qc)
20.70W
Electrical Power In
34.20W
Efficiency (COP)
0.605
Hot-Side Heat (Qh)
54.90W

Performance Curves vs. Operating Current

Current Parametric Sweep

Current (A)Cooling Power Qc (W)COPInput Power (W)
0.000.000.0000.00
1.250.280.0634.50
2.5011.250.76914.63
3.7519.410.63930.38
5.0024.750.47851.75
6.2527.280.34678.75
7.5027.000.242111.38
8.7523.910.160149.63
10.0018.000.093193.50
11.259.280.038243.00
12.500.000.000298.13
13.750.000.000358.88
15.000.000.000425.25